KUNSHAN AISEN SHIHUA OPTOELECTRONIC MATERIALS CO., LTD. is seeking bids for Contract Awarded For 0730-264010sz0072/01 Wafer Electroplating Gold sky Chip Interconnection Technology Co., Ltd Project-wafer Electroplating Gold Machine (rebid) Sky Chip Interconnection Technology Co., Ltd 2026-05-21 10:00 2026-05-22 17:09 - 2026-05-25 in China. Interested suppliers and service providers may participate until 02 Sep 2026.

Contract Awards

Contract TI Ref No

533754082

Contract Date

07 Jun 2026

Contract Description

Contract Awarded For 0730-264010sz0072/01 Wafer Electroplating Gold sky Chip Interconnection Technology Co., Ltd Project-wafer Electroplating Gold Machine (rebid) Sky Chip Interconnection Technology Co., Ltd 2026-05-21 10:00 2026-05-22 17:09 - 2026-05-25

Tender Deadline

⏰ 02 Sep 2026 Closing soon

Contract Project Location

China

Contract Sector

IT - Hardware Tenders

Contract CPV

Microelectronic machinery and apparatus Tenders

Contract Document Type

Contract Awards

Tender Organization Name

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