Home› Contract Award - Contract Awarded For Bump Flattening Machine boe Glass Substrate?project Beijing Boe Sensor Technology Co.,ltd. 2026-05-07 10:00 2026-05-10 20:45 - 2026-05-13 23:59 2026-05-14 11:41.bump Flattening Machine, China (532890510)

ALLTECH ELECTRONIC TECHNOLOGY CO., LIMITED has invited bids for Contract Awarded For Bump Flattening Machine boe Glass Substrate?project Beijing Boe Sensor Technology Co.,ltd. 2026-05-07 10:00 2026-05-10 20:45 - 2026-05-13 23:59 2026-05-14 11:41.bump Flattening Machine in China. Interested bidders can submit proposals until 14 Aug 2026.

Contract Awards

Contract Awards
Contract TI Ref No
532890510
Contract Date
15 May 2026
Contract Description
Contract Awarded For Bump Flattening Machine boe Glass Substrate?project Beijing Boe Sensor Technology Co.,ltd. 2026-05-07 10:00 2026-05-10 20:45 - 2026-05-13 23:59 2026-05-14 11:41.bump Flattening Machine
Tender Deadline
⏰ 14 Aug 2026 Closing soon
Contract Project Location
China
Contract Sector
IT - Software Tenders
Contract CPV
Information Technology Consultancy Services , Project Management Consultancy Services Tenders
Contract Document Type
Contract Awards
Tender Organization Name
🔒 Members only Click for more details
Unlock Full Details — Register Free
Start with receiving Free Data Samples related to your Products and Services
✓
Live Tender Updates from worldwide
✓
Access to original Tender Documents
✓
Information on Upcoming Projects & Contract Awards
✓
Bid Assistance Services
✓
Competitor Analysis & Industry Trends
✓
Daily Custom Email Alerts by Sector & Country

Similar Contracts

View All IT - Software Tenders Tenders ->

Register to View Tenders

Start Your Business Journey. Register now for 3 days Free Sample Tenders & AI Website Demo.

Already have an account? Login here

By registering you agree to our Terms & Conditions and Privacy Policy.