LEICA MICROSYSTEMS UK LTD is seeking bids for Contract Awarded For : Ca17932 - Maint6645- Rfl - Bond-max Processing Module maint6645- Rfl - Bond-max Processing Module to Access This Competition: registered: login To Https://suppliers.multiquote.com And View The Opportunity Ca17932. not Registered in United kingdom. Interested suppliers and service providers may participate until 01 Sep 2026.

Contract Awards

Contract TI Ref No

533602258

Contract Date

03 Jun 2026

Contract Description

Contract Awarded For : Ca17932 - Maint6645- Rfl - Bond-max Processing Module maint6645- Rfl - Bond-max Processing Module to Access This Competition: registered: login To Https://suppliers.multiquote.com And View The Opportunity Ca17932. not Registered

Tender Deadline

⏰ 01 Sep 2026 Closing soon

Contract Project Location

United Kingdom

Contract Sector

IT - Hardware Tenders

Contract CPV

Modules Tenders

Contract Document Type

Contract Awards

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