Bids are invited by BEIJING NAURA MICROELECTRONICS EQUITMENT CO.,LTD. for Contract Awarded For Package 04:purchase 1 Set Of Brand-new 8-inch Deep Silicon Etching Equipment, To Be Used In The Dry Etching Process Of The 8-inch Production Line, For Realizing The Deep Silicon Etching Process In The Manufacturing Flow Of Semiconduc in China. The tender remains open for submissions until 09 Sep 2026.

Contract Awards

Contract Awards
Contract TI Ref No
534155612
Contract Date
16 Jun 2026
Contract Description
Contract Awarded For Package 04:purchase 1 Set Of Brand-new 8-inch Deep Silicon Etching Equipment, To Be Used In The Dry Etching Process Of The 8-inch Production Line, For Realizing The Deep Silicon Etching Process In The Manufacturing Flow Of Semiconduc
Tender Deadline
⏰ 09 Sep 2026 Closing soon
Contract Project Location
China
Contract Sector
IT - Hardware Tenders
Contract CPV
Microelectronic machinery and apparatus Tenders
Contract Document Type
Contract Awards
Tender Organization Name
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