Home› Tender for Second Phase Of The Intelligent Computing Infrastructure Electromechanical Project Of China Unicom Sichuan Tianfu Information Center Data Center, China

An invitation to bid has been published by CHINA INTERNATIONAL TENDERING CO., LTD. for Second Phase Of The Intelligent Computing Infrastructure Electromechanical Project Of China Unicom Sichuan Tianfu Information Center Data Center in China. The tender closing date is 03 Jul 2026.

Tender Notice

Tender Notice
Tender TI Ref No
533897868
Tender Date
10 Jun 2026
Tender Description
Tender for Second Phase Of The Intelligent Computing Infrastructure Electromechanical Project Of China Unicom Sichuan Tianfu Information Center Data Center
Tender Deadline
⏰ 03 Jul 2026 Closing soon
Tender Project Location
China
Tender Sector
IT - Software Tenders
Tender CPV
Information Technology Consultancy Services , Project Management Consultancy Services Tenders
Tender Document Type
Tender Notice
Tender Organization Name
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