Home› Tender for Thin Section Lapping And Polishing Equipment And Thin Section/sample Saw (call For Tenders No. 2), Finland

GEOLOGICAL SURVEY OF FINLAND GTK is seeking bids for Thin Section Lapping And Polishing Equipment And Thin Section/sample Saw (call For Tenders No. 2) in Finland. Interested suppliers and service providers may participate until 03 Jun 2026.

Tender Notice

Tender Notice
Tender TI Ref No
532450781
Tender Date
07 May 2026
Tender Description
Tender for Thin Section Lapping And Polishing Equipment And Thin Section/sample Saw (call For Tenders No. 2)
Tender Deadline
⏰ 03 Jun 2026 Closing soon
Tender Project Location
Finland
Tender Sector
Industry - Machinery Tenders
Tender CPV
Machine tools for finishing metals Tenders
Tender Document Type
Tender Notice
Tender Organization Name
🔒 Members only Click for more details
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