Home› Tender for Wafer Surface Plasma Activation Equipment Set, Japan

Bids are invited by National University Corporation for Wafer Surface Plasma Activation Equipment Set in Japan. The tender remains open for submissions until 13 Jul 2026.

Tender Notice

Tender Notice
Tender TI Ref No
534337912
Tender Date
20 Jun 2026
Tender Description
Tender for Wafer Surface Plasma Activation Equipment Set
Tender Deadline
⏰ 13 Jul 2026 Closing soon
Tender Project Location
Japan
Tender Sector
IT - Hardware Tenders
Tender CPV
Microelectronic machinery and apparatus Tenders
Tender Document Type
Tender Notice
Tender Organization Name
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