Home› Contract Award - Contract Awarded For Module Pcb Bonding Machine gzcsot G8.6 Oxide Semiconductor Display Project Guangzhou China Star Optoelectronics Semiconductor Display Technology Co.,ltd. 2026-05-12 10:00 2026-05-15 18:21 - 2026-05-20 23:59 2026-05-21 16:29.module Pc, China (533233099)

An invitation to bid has been published by SHENZHEN LIANDE AUTOMATION EQUIPMENT CO.,LTD for Contract Awarded For Module Pcb Bonding Machine gzcsot G8.6 Oxide Semiconductor Display Project Guangzhou China Star Optoelectronics Semiconductor Display Technology Co.,ltd. 2026-05-12 10:00 2026-05-15 18:21 - 2026-05-20 23:59 2026-05-21 16:29.module Pc in China. The tender closing date is 21 Aug 2026.

Contract Awards

Contract Awards
Contract TI Ref No
533233099
Contract Date
24 May 2026
Contract Description
Contract Awarded For Module Pcb Bonding Machine gzcsot G8.6 Oxide Semiconductor Display Project Guangzhou China Star Optoelectronics Semiconductor Display Technology Co.,ltd. 2026-05-12 10:00 2026-05-15 18:21 - 2026-05-20 23:59 2026-05-21 16:29.module Pc
Tender Deadline
⏰ 21 Aug 2026 Closing soon
Contract Project Location
China
Contract Sector
Telecommunications Tenders
Contract CPV
Printed circuit board (PCB). Tenders
Contract Document Type
Contract Awards
Tender Organization Name
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