An invitation to bid has been published by SHENYANG HEYAN TECHNOLOGY CO.,LTD for Contract Awarded For Procure One Set Of Brand-new 8-inch Taiko Ring-cut Machine For The 8-inch Taiko Ring-cutting Process. This Aims To Achieve The Taiko Ring-cutting Step In The 8-inch Wafer Fabrication Flow For Semiconductor Integrated Circuits. (the P in China. The tender closing date is 30 Jun 2026.
Start Your Business Journey. Register now for 3 days Free Sample Tenders & AI Website Demo.