Home› Project - Chip Development Facility In Yokohama, Korea, republic of (488326630)

SAMSUNG ELECTRONICS has issued a public tender related to Chip Development Facility In Yokohama in Korea, republic of. Interested bidders can submit applications before 31 Dec 2025.

Project Information

Project Information
Project TI Ref No
488326630
Project Date
16 May 2023
Project Description
Chip Development Facility In Yokohama
Tender Deadline
⏰ 31 Dec 2025 Closing soon
Project Project Location
Japan
Project Sector
Information Technology (IT) Tenders IT - Hardware Tenders IT - Software Tenders Infrastructure and construction Tenders
Project Estimated Cost
USD 222.00 Million
Project Document Type
Project Information
Tender Organization Name
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