Home› Contract Award - Contract Awarded For Wafer Deep Hole Cleaning Machine 1 Unite icb For Wafer Deep Hole Cleaning Machine Of Shanghai Xinyuan Innovation Center Shanghai Xinyuan Innovation Center 2026-05-07 10:30 2026-05-09 09:13 - 2026-05-12 23:59 2026-05-13 16:33.wafer De, China (532890103)

Contract Awards

Contract Awards
Contract TI Ref No
532890103
Contract Date
15 May 2026
Contract Description
Contract Awarded For Wafer Deep Hole Cleaning Machine 1 Unite icb For Wafer Deep Hole Cleaning Machine Of Shanghai Xinyuan Innovation Center Shanghai Xinyuan Innovation Center 2026-05-07 10:30 2026-05-09 09:13 - 2026-05-12 23:59 2026-05-13 16:33.wafer De
Tender Deadline
⏰ 13 Aug 2026 Closing soon
Contract Project Location
China
Contract Sector
Services Tenders
Contract CPV
Building-cleaning services Tenders
Contract Document Type
Contract Awards
Tender Organization Name
🔒 Members only Click for more details
Tender Organization Name
🔒 Members only Click for more details
Tender Organization Name
🔒 Members only Click for more details
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