Home› Tender for Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)- Vertical Continuous Plating System 1set, China

Tender Notice

Tender Notice
Tender TI Ref No
532029968
Tender Date
24 Apr 2026
Tender Description
Tender for Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)- Vertical Continuous Plating System 1set
Tender Deadline
⏰ 15 May 2026 Closing soon
Tender Project Location
China
Tender Sector
Industry - Fire Safety and Security Tenders
Tender CPV
Closed-circuit surveillance system(CCTV) Tenders
Tender Document Type
Tender Notice
Tender Organization Name
🔒 Members only Click for more details
Tender Organization Name
🔒 Members only Click for more details
Tender Organization Name
🔒 Members only Click for more details
Unlock Full Details — Register Free
Start with receiving Free Data Samples related to your Products and Services
✓
Live Tender Updates from worldwide
✓
Access to original Tender Documents
✓
Information on Upcoming Projects & Contract Awards
✓
Bid Assistance Services
✓
Competitor Analysis & Industry Trends
✓
Daily Custom Email Alerts by Sector & Country

Similar Tenders

View All Industry - Fire Safety and Security Tenders Tenders ->

Register to View Tenders

Start Your Business Journey. Register now for 3 days Free Sample Tenders & AI Website Demo.

Already have an account? Login here

By registering you agree to our Terms & Conditions and Privacy Policy.