Home› Tender for Request For Proposal For Mmic Assembly, Packaging And Screening In Kyocera Packages Packaged Spdt Mmic Die, Mmic Die Spdt Lat, Mmic Die Spdt Wlat, Packaged Digital Attenuator (da) Mmic Die (type-1), Mmic Die Digital Attenuator (da) (type-1) Lat, Packaged, India

Tender Notice

Tender Notice
Tender TI Ref No
532002860
Tender Date
24 Apr 2026
Tender Description
Tender for Request For Proposal For Mmic Assembly, Packaging And Screening In Kyocera Packages Packaged Spdt Mmic Die, Mmic Die Spdt Lat, Mmic Die Spdt Wlat, Packaged Digital Attenuator (da) Mmic Die (type-1), Mmic Die Digital Attenuator (da) (type-1) Lat, Packaged
Tender Deadline
⏰ 21 Apr 2026 Closing soon
Tender Project Location
Gujarat - India
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