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TAIWAN, PROVINCE OF CHINA : Winbond signs NT$7bn loan deal for upgrades
Publish Date : 20-Sep-2011
Memorychip maker Winbond Electronics Corp has signed a NT$7 billion (US$235.06 million) five-year syndicated loan agreement with 17 domestic banks to finance equipment procurement for technology upgrades.
The syndicated loan was led by Bank of Taiwan, Chinatrust Commercial Bank, First Commercial Bank, Taiwan Cooperative Bank, Taishin International Bank, E.Sun Bank, Taipei Fubon Commercial Bank, DBS Bank and consisted of nine other financial institutions. The loan subscription was more than NT$10 billion and the final facility amount was closed at NT$7 billion, reflecting high support from financial institutions for the company’s credit rating and positive business prospects.
The company has continued to focus on Specialty Memory, with three major product lines of Specialty DRAM, Mobile RAM and NOR Flash, company statement showed.
