Publish Date : 14-Aug-2014
Huawei, a leading global information and communications technology (ICT) solutions provider, today signed a Memorandum of Understanding (MoU) with Telekom Research & Development Sdn Bhd (TM R&D), a wholly owned subsidiary of Telekom Malaysia Berhad (TM), at TM Convention Center. The MoU aims to launch joint innovation efforts to co-develop next generation access technologies for both fixed-line and wireless connectivity in Malaysia. The MoU will see Huawei and TM R&D jointly research the most suitable, customized copper access and 4G solutions for Malaysia’s fixed and broadband landscapes. Through this collaboration, both parties will share research facilities and encourage knowledge transferring, as well as establish a joint lab within the TM Innovation Center, in Cyberjaya within the Multimedia Super Corridor (MSC) of Malaysia.
Dr. Gopi Kurup, Chief Executive Officer, TM R&D and Mr. Mike Wang, Chief Executive Officer of Huawei Malaysia signed the MoU, with Mr. Dato’ Danapalan TP Vinggrasalam, Chairman of TM R&D and Mr. Zou Zhilei, President of Huawei Carrier Business Group, presented to witness the ceremony. Commenting on the partnership, Mr. Mike Wang said, "Being a part of Malaysia’s digital transformation has been an exciting experience for us at Huawei. TM’s High Speed Broadband (HSBB) project has become a global reference point of future-oriented smart networks. By jointly developing technologies that utilize TM’s existing copper wires, TM can make efficient use of resources, quickly implement bandwidth strategies, and launch additional new services, including IPTV and HDTV based on the fast broadband to score more commercial success. After achieving huge success as a fixed network operator, we are very excited to be a part of TM’s transformation into a full-fledged fixed-line and mobile player. TM shares our enthusiasm for bridging the connectivity gap, enhancing Malaysia’s status as an investment destination with world-class connectivity solutions, and continuously enabling the next level of ‘digital life’ for consumers and businesses alike, through ongoing innovation."
"Huawei shares our passion for innovation and co-development partnerships. With strong commitment from both parties, we are confident of contributing to a competitive next generation ICT infrastructure for the nation. The collaboration reflects our commitment to evolve the nation’s HSBB network project and underpins the long term value of TM’s current assets. We believe the next generation access technologies will further enhance our broadband user experience and TM’s wireless coverage in the long run," said Dr.Gopi Kurup. Malaysia's RM11.3 billion HSBB project was a globally-acclaimed success, in terms of the scope of the endeavour, the speed of its completion as well as its take-up rate.
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