Tender Notice

Tender TI Ref No :

526932081

Tender Date :

01 Jan 2026

Tender Description :

Tender for The Subject Of The Order Is The Delivery Of A Pick-and-place Device (die Bonder) Intended For Manual Assembly Of Chips, Electronic Components, And Microcircuits, Which Includes: Delivery Of The Device, Installation And Commissioning, Testing For Correct O

Tender Deadline :

23 Jan 2026

Tender Project Location :

Poland

Tender Sector :

Industry - Automobiles Tenders

Tender CPV :

Articulated trucks Tenders

Tender Document Type :

Tender Notice

Tender Organization Name :

Click for more details

Tender Original Document :

Click for more details

Tender Funding Agency :

Click for more details

Register to View Tenders

Start Your Business Journey. Register now for 7 days Free Sample Tenders & AI Website Demo.

Name*

Email ID*

Mobile No*

Organization name*

Country*

Start with receiving Free Data Samples related to your Products and Services

Live Tender Updates from worldwide
Access to original Tender Documents
Information on Upcoming Projects and Contract Awards
Bid Assistance Services
Competitior Analysis & Industry Trends

Tender Notice

Register to View Tenders

Start Your Business Journey. Register now for 7 days Free Sample Tenders & AI Website Demo.

Congratulations!

Start with receiving Free Data Samples related to your Products and Services

Member Login