Tender for Bzp: 585_delivery Of Pick-and-place Die Bonder Device, Poland

Home » Tender for Bzp: 585_delivery Of Pick-and-place Die Bonder Device, Poland

Tender Notice

Tender TI Ref No :

526957570

Tender Date :

02 Jan 2026

Tender Description :

Tender for Bzp: 585_delivery Of Pick-and-place Die Bonder Device

Tender Deadline :

15 Jan 2026

Tender Project Location :

Poland

Tender Sector :

Industry - Automobiles Tenders

Tender CPV :

Articulated trucks Tenders

Tender Document Type :

Tender Notice

Tender Organization Name :

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Tender Original Document :

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Tender Funding Agency :

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