Tender for Wafer Transfer Machine For 300mm Wafer 1 Set, Japan

Home » Tender for Wafer Transfer Machine For 300mm Wafer 1 Set, Japan

Tender Notice

Tender TI Ref No :

527253450

Tender Date :

07 Jan 2026

Tender Description :

Tender for Wafer Transfer Machine For 300mm Wafer 1 Set

Tender Deadline :

26 Feb 2026

Tender Project Location :

Japan

Tender Sector :

IT - Hardware Tenders

Tender CPV :

Microelectronic machinery and apparatus Tenders

Tender Document Type :

Tender Notice

Tender Organization Name :

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Tender Original Document :

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Tender Funding Agency :

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