Tender for Shandong Youyan Integrated Circuit 8-inch Silicon Wafer Expansion Project Phase Iii Edge Polishing Machine Procurement, China

Home » Tender for Shandong Youyan Integrated Circuit 8-inch Silicon Wafer Expansion Project Phase Iii Edge Polishing Machine Procurement, China

Tender Notice

Tender TI Ref No :

527264721

Tender Date :

07 Jan 2026

Tender Description :

Tender for Shandong Youyan Integrated Circuit 8-inch Silicon Wafer Expansion Project Phase Iii Edge Polishing Machine Procurement

Tender Deadline :

28 Jan 2026

Tender Project Location :

China

Tender Sector :

IT - Hardware Tenders

Tender CPV :

Microelectronic machinery and apparatus Tenders

Tender Document Type :

Tender Notice

Tender Organization Name :

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Tender Original Document :

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Tender Funding Agency :

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