Tender for Fudan University Active Silicon Interposer Chip Modification And Design Services, China

Home » Tender for Fudan University Active Silicon Interposer Chip Modification And Design Services, China

Tender Notice

Tender TI Ref No :

527343526

Tender Date :

09 Jan 2026

Tender Description :

Tender for Fudan University Active Silicon Interposer Chip Modification And Design Services

Tender Deadline :

29 Jan 2026

Tender Project Location :

China

Tender Sector :

Consultancy - Engineering Tenders

Tender CPV :

Building consultancy services Tenders

Tender Document Type :

Tender Notice

Tender Organization Name :

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Tender Original Document :

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Tender Funding Agency :

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