Tender Notice

Tender TI Ref No :

530448886

Tender Date :

17 Mar 2026

Tender Description :

Tender for The Object Of The Procurement Is A Cluster Sputtering Tool For The Vtt Micronova Cleanroom. It Must Include Co-sputtering Capability With Multiple Targets For Double-side Coated Wafers And Wafer Carriers. Furthermore, It Must Be Possible To Extend The Sys

Tender Deadline :

13 Jun 2026

Tender Project Location :

Finland

Tender Sector :

IT - Hardware Tenders

Tender CPV :

Microelectronic machinery and apparatus Tenders

Tender Document Type :

Tender Notice

Tender Organization Name :

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Tender Original Document :

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Tender Funding Agency :

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