Tender TI Ref No :

530727705

Tender Date :

23 Mar 2026

Tender Description :

Tender for A Complete Set Of High-vacuum Sputtering Equipment Capable Of Multiple And Simultaneous Film Formation

Tender Deadline :

20 Apr 2026

Tender Project Location :

Japan

Tender Sector :

IT - Hardware Tenders

Tender CPV :

Microelectronic machinery and apparatus Tenders

Tender Document Type :

Tender Notice

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Tender Original Document :

Tender Funding Agency :

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