Tender Notice

Tender TI Ref No :

530765254

Tender Date :

24 Mar 2026

Tender Description :

Tender for Supply And Installation Of A Multi-purpose Chip Bonding System And Advanced Materials Dispenser. Funded By The European Union - Nextgenerationeu For The Recovery And Resilience Mechanism. Scientific Project Code: (micronanofabs_phase 2)-icts-mrr-2024-04-c

Tender Deadline :

08 Apr 2026

Tender Project Location :

Spain

Tender Sector :

Infrastructure - Building Tenders

Tender CPV :

construction work for multi-functional buildings Tenders

Tender Estimated Cost :

170000

Tender Document Type :

Tender Notice

Tender Organization Name :

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Tender Original Document :

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Tender Funding Agency :

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