Tender Notice
Tender NoticeTender TI Ref No
531762187
Tender Date
18 Apr 2026
Tender Description
Tender for Tender Invited For Communication Buffer Module , Psu For Solenoids , Psu For Plc , Psu For I Byo Put Module , Proximity Senser , D O Byp Output Module , D I Byp Input Module , 8 Channel 1no Bync Relay Module , Cvt 3 Kva , Rubber Expansion Joint For Main P
Tender Deadline
⏰ 21 Apr 2026
Closing soon
Tender Project Location
Madhya Pradesh - India
Tender Sector
Industry Tenders
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Tender Estimated Cost
2.95 Million
Tender Document Type
Tender Notice
Tender Organization Name
🔒 Members only
Click for more details
Tender Organization Name
🔒 Members only
Click for more details
Tender Organization Name
🔒 Members only
Click for more details
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