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Project TI Ref No :

485933419

Project Date :

01 Aug 2023

Project Description :

Semiconductor Assembly Testing Marking And Packaging atmp Park In Uttar Pradesh, India

Project Deadline :

31 Dec 2025

Project Project Location :

N/A

Project Sector :

Industry - Paper & Packaging Tenders , Science & Technology Tenders , Telecommunications Tenders , Energy, Power and Electrical Tenders , Water and Sanitation Tenders , Infrastructure and construction Tenders

Project Document Type :

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