Project TI Ref No :

491123494

Project Date :

12 Jul 2023

Project Description :

Chip Packaging Plant In India, Korea, republic of

Project Deadline :

31 Dec 2025

Project Project Location :

N/A

Project Sector :

Industry - Paper & Packaging Tenders , IT - Hardware Tenders , IT - Software Tenders , Infrastructure and construction Tenders

Project Document Type :

Project Information

Project Organization Name :

Project Original Document :

Project Funding Agency :