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Tender Notice

Tender TI Ref No :

516765841

Tender Date :

11 Apr 2025

Tender Description :

Shandong Grinm Rs 12 Inch Integrated Circuit Large Silicon Wafer Industrialization Project Phase Ii Silicon Wafer Double-sided Polishing Machine Procurement, China

Tender Deadline :

06 May 2025

Tender Project Location :

N/A

Tender Sector :

IT - Hardware Tenders

Tender CPV :

Microelectronic machinery and apparatus Tenders

Tender Document Type :

Tender Notice

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Tender Original Document :

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