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Tender Notice

Tender TI Ref No :

518311846

Tender Date :

23 May 2025

Tender Description :

Request For Proposals For A Wafer Dicing Saw Summary. The Arizona Board Of Regents (abor), On Behalf Of The University Of Arizona, Is soliciting Proposals From Interested Vendors To Furnish The University With A Silicon Wafer Dicing saw 05/22/2025 Te, United states

Tender Deadline :

05 Jun 2025

Tender Project Location :

N/A

Tender Sector :

Industry Tenders

Tender CPV :

Sawing equipment Tenders

Tender Document Type :

Tender Notice

Tender Organization Name :

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Tender Original Document :

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Tender Funding Agency :

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