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Tender Notice

Tender TI Ref No :

519204552

Tender Date :

16 Jun 2025

Tender Description :

pvd cluster Tool. The Pvd System Must Support Metal Deposition applications For Cu Or Au Barrier/seed Layers For Tsv And Rdl, As well As Underbump Metallization (ubm) Solutions And Aluminum Layers. it Must Enable Uniform Coverage, Germany

Tender Deadline :

14 Jul 2025

Tender Project Location :

N/A

Tender Sector :

IT - Hardware Tenders

Tender CPV :

Microelectronic machinery and apparatus Tenders

Tender Document Type :

Tender Notice

Tender Organization Name :

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Tender Original Document :

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Tender Funding Agency :

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